List of integrated circuit packaging types

A standard-sized 8-pin dual in-line package (DIP) containing a 555 timer IC.

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.

Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.

Through-hole package

Through hole technology uses holes drilled through the PCB for mounting the components. The component has leads that are soldered to pads on the PCB to electrically and mechanically connect them to the PCB.

Three 14-pin (DIP14) plastic dual in-line packages containing IC chips.

Acronym	Full name	Remark
SIP	Single in-line package
DIP	Dual in-line package	0.1 in (2.5 mm) pin spacing, rows 0.3 in (7.6 mm) or 0.6 in (15 mm) apart.
CDIP	Ceramic DIP]
CERDIP	Glass sealed ceramic DIP
QIP	Quadruple in-line package	Like DIP but with staggered (zig-zag) pins.
SDIP	Skinny DIP	Standard DIP with 0.1 in pin spacing, rows 0.3 in apart.
ZIP	Zig-zag in-line package
MDIP	Molded DIP.
PDIP	Plastic DIP.

Surface mount

Acronym	Full name	Remark
CCGA	Ceramic Column Grid Array (CGA)
CGA	Column Grid Array	Example
CERPACK	Ceramic package
CQGP
LLP	Lead-Less lead-frame Package	A package with metric pin distribution (0.5–0.8 mm pitch)
LGA	Land Grid Array
LTCC	Low temperature co-fired ceramic
MCM	Multi-Chip Module
MICRO SMDXT	Micro Surface Mount Device extended technology	Example

Chip carrier

A chip carrier is a rectangular package with contacts on all four edges. Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.

Acronym	Full name	Remark
BCC	Bump Chip Carrier	-
CLCC	Ceramic Leadless Chip Carrier	-
LCC	Leadless Chip Carrier	Contacts are recessed vertically.
LCC	Leaded Chip Carrier	-
LCCC	Leaded Ceramic Chip Carrier	-
DLCC	Dual Lead-Less Chip Carrier (Ceramic)	-
PLCC	Plastic Leaded Chip Carrier	-

Pin grid arrays

Main article: Pin grid array

Acronym	Full name	Remark
OPGA	Organic Pin Grid Array	-
FCPGA	Flip-chip Pin Grid Array	-
PAC	Pin Array Cartridge	-
PGA	Pin grid array	also known as PPGA
CPGA	Ceramic Pin Grid Array	-

Flat packages

Main article: Quad Flat Package

Acronym	Full name	Remark
-	Flatpack	Earliest version metal/ceramic packaging with flat leads
CFP	Ceramic Flat Pack	-
CQFP	ceramic quad flat-pack, similar to PQFP	-
BQFP	Bumpered Quad Flat Pack	-
DFN	Dual Flat Pack	No Lead
ETQFP	Exposed Thin Quad Flat Package	-
PQFN	power quad flat-pack	No-leads, with exposed die-pad[s] for heatsinking
PQFP	Plastic quad flat package	-
LQFP	Low-profile Quad Flat Package	-
QFN	Quad Flat No Leads	Also called as micro lead frame (MLF).
QFP	Quad Flat Package	-
MQFP	Metric Quad Flat Pack	QFP with metric pin distribution
HVQFN	Heat-sink very-thin quad flat-pack no-leads	-
SIDEBRAZE	-	-
TQFP	Thin Quad Flat Pack	-
TQFN	Thin Quad Flat No-Lead	-
VQFP	Very-thin Quad Flat Pack	-
ODFN	Optical Dual Flat No-Lead	IC packaged in transparent packaging used in optical sensor

Small outline packages

Acronym	Full name	Remark
SOP	Small Outline Package	-
CSOP	Ceramic Small Outline Package	-
MSOP	Mini Small-Outline Package	-
PSOP	Plastic small-outline package	-
PSON	Plastic small-outline no lead package	-
QSOP	Quarter-Size Small-Outline Package	The pin spacing are width of 0.635 mm.
SOIC	Small Outline Integrated Circuit	Also known as SOIC NARROW and SOIC WIDE
SSOP	Shrink Small-Outline Package	-
TSOP	Thin Small-outline Package	Example
TSSOP	Thin Shrink Small Outline Package	-
TVSOP	Thin Very Small-Outline Package	-
µMAX	-	Similar to a SOIC. (A Maxim trademark example)
WSON	-	Very Very Thin Small Outline No Lead Package

Chip-scale packages

Example WL-CSP devices sitting on the face of a U.S. penny. A SOT-23 device is shown for comparison.

Acronym	Full name	Remark
CSP	Chip Scale Package	Package size is no more than 1.2× the size of the silicon chip
TCSP	True Chip Size Package	Package is same size as silicon
TDSP	True Die Size Package	Same as TCSP
MICRO SMD	-	Chip-size package (CSP) developed by National Semiconductor
COB	Chip-on-board	Bare silicon chip, that is usually an integrated circuit, is supplied without a package.
COF	Chip-on-flex	Variation of COB, where a chip is mounted directly to a flex circuit.
COG	Chip-on-glass	Variation of COB, where a chip is mounted directly to a piece of glass - typically an LCD.

Ball grid array

Main article: Ball grid array

Ball Grid Array uses the underside of the package to place pads with balls of solder in grid pattern as connections to PCB.

Acronym	Full name	Remark
FBGA	fine pitch ball grid array	a square or rectangular array of solder balls on one surface
LBGA	Low Profile Ball Grid Array	also known as Laminate Ball Grid Array
TEPBGA	Thermally Enhanced Plastic BGA	-
CBGA	Ceramic Ball Grid Array	-
OBGA	Organic Ball Grid Array	-
TFBGA	Thin fine pitch BGA.	-
PBGA	Plastic Ball Grid Array	-
MAP-BGA	Mold Array Process-Ball Grid Array [1]	-
UCSP	Micro (μ) Chip Scale Package	Similar to a BGA (A Maxim trademark example)
μBGA	Micro-BGA (Ball grid array)	With ball spacing less than 1 mm
LFBGA	Low profile fine pitch ball grid array	-
TBGA	Thin Ball Grid Array	-
SBGA	Super BGA - above 500 Pin count	-
UFBGA	Ultra Fine BGA	Example

Transistor, diode, small pin count IC packages

A drawing of a ZN414 IC in a TO-18 package

• MELF: Metal Electrode Leadless Face (usually for resistors and diodes)
• SOD: Small Outline Diode.
• SOT: Small Outline Transistor (also SOT-23, SOT-223, SOT-323).
• TO-XX: wide range of small pin count packages often used for discrete parts like transistors or diodes.
  • TO-3
  • TO-5
  • TO-18: metal can package with radial leads
  • TO-39
  • TO-46
  • TO-92: plastic encapsulated package with three leads
  • TO-99
  • TO-100
  • TO-126: plastic encapsulated package with three leads and a hole for mounting on a heat sink
  • TO-220: through-hole plastic package with a (usually) metal heat sink tab and three leads
  • TO-226
  • TO-247
  • TO-252 (also called SOT428, DPAK)
  • TO-263, also called D2PAK: SMT package similar to the TO-220
  • TO-263 THIN

Multi-chip packages

Occasionally people put several chips of silicon in a single package. A variety of techniques for interconnecting several chips within a single package have been proposed and researched:

• SiP (system in package)
• PoP (package on package)
• 3D-SICs, Monolithic 3D ICs, and other three-dimensional integrated circuit
• WSI (wafer-scale integration)
• proximity communication

See also

• Interposer
• IPC (electronics)
• List of chip carriers
• List of electronics package dimensions
• Redistribution layer
• Surface-mounted package sizes
• Wafer-level packaging

External links

• JEDEC JEP95 official list of all (over 500) standard electronic packages
• Fairchild Index of Package Information
• An illustrated listing of different package types, with links to typical dimensions/features of each